Electronics

According to MediaTek's first quarter financial report in 2022, revenue in the first quarter was about 32.2 billion yuan, a quarterly increase of 10.9% and an annual increase of 32.1%. With the release of the Dimensity 9000, MediaTek has taken a key step in the smartphone flagship chip market. In the future, with the continuous expansion of the high-end flagship mobile phone market, MediaTek will also overcome difficulties in the field of high-end flagship mobile phone chips and create better products.

Dimensity 9000 promotes the development of MediaTek in the high-end mobile phone market

Nowadays, with the continuous popularization of 5G, people's demand for high-end mobile phones is becoming stronger and stronger. Counterpoint data shows that in 2021, the global high-end smartphone market sales will increase by 24% year-on-year, reaching the highest level in history. In order to meet the needs of consumers, MediaTek has also begun to make continuous efforts in the high-end mobile phone market, and flagship high-end mobile phone chips such as the Dimensity 9000 came into being, which also greatly promoted the development of MediaTek in the high-end mobile phone market.

Li Yanji, deputy general manager of MediaTek's wireless communication business unit, said that in recent years, the mobile phone market has entered a replacement cycle of consumption upgrades, consumers' demand for replacement phones continues to be "high-end", and the high-end market has also become a persistent development of MediaTek. direction. The reason why the Dimensity 9000 can make a leap in the high-end mobile phone market is achieved through long-term accumulation, which is mainly reflected in two aspects:

First, through long-term technical research, Dimensity's products and technologies have been greatly improved, and its layout in performance, energy efficiency, AI, games, imaging, and communications has been recognized by the market. Second, MediaTek has also made great breakthroughs in cooperation with terminal manufacturers. In recent years, MediaTek and customers have achieved many technological innovations in the high-end market, and jointly explore differentiated and personalized user experience with terminal manufacturers. For example, through the Dimensity open architecture and terminal manufacturers to do collaborative development based on the Dimensity platform, it provides better performance and innovative functions for Dimensity's terminals. For the first time, MediaTek and vivo have achieved a "two-core combination" on the X80 series, achieving the application effect of 1+1>2 and reshaping the flagship experience of the high-end mobile phone market. This also has a positive effect on the acceleration of the high-end mobile phone market and the structural upgrade of products.

Meeting challenges in the high-end mobile phone market

The Dimensity brand was born in response to the 5G era. The 5G market has huge potential, and at the same time, the development of high-end flagship mobile phones in this market also faces new challenges.

Li Yanji said that the development of high-end flagship mobile phones is mainly faced with two challenges. First of all, high power consumption and heating problems are the biggest pain points generally faced by high-end flagship phones. Especially in the early stage of 5G commercial use, almost all 5G smartphones face problems such as excessive power consumption and poor user experience. When MediaTek's first 5G mobile platform Dimensity 1000 was launched in the first year of 5G commercial use, it effectively solved the problem of users with advanced and highly integrated 5G single-chip, 5G+5G dual-card, 5G carrier aggregation, 5G UltraSave power saving and other technologies. The pain point has played a very big role in promoting the popularization of 5G mobile phones.

With its outstanding performance and energy efficiency, the Dimensity 9000 has reshaped the benchmark-level user experience of flagship mobile phones with excellent platform design and global energy efficiency optimization technology, and has become the "best choice" for smartphones to hit the high-end market. High energy efficiency and low power consumption have also become the labels of Dimensity.

Secondly, creating a "differentiated" advantage is an important challenge for flagship mobile phones. Different from the previous Turkey solutions, the "Tianji Open Architecture" launched by MediaTek last year is an important deployment that focuses on the future and creates "differentiated" advantages. MediaTek's Dimensity open architecture is based on the Dimensity series of 5G mobile platforms, and cooperates with terminal manufacturers in depth to bring a more personalized user experience, empower terminal manufacturers to create differentiated flagship 5G smartphones, and release unlimited potential.

According to Li Yanji, Dimensity's open architecture has been implemented globally and applied to OPPO, vivo, Xiaomi, and the sub-brands of these customers. In overseas markets, OnePlus Nord2 uses Dimensity 1200-AI, and Xiaomi Mi 11T uses Dimensity 1200-Ultra. In the Chinese market, vivo X70 uses Dimensity 1200-vivo, and OnePlus Ace uses Dimensity 8100-MAX. In the future, there will be more landing application results of "Tianji Open Architecture".

In the future, we will work hard to move forward

In the future, with the continuous development of technologies such as 5G, the market competition for high-end flagship mobile phones will also become more intense. In this regard, Li Yanji said that in the face of increasingly fierce market competition, MediaTek will continue to overcome difficulties in the high-end flagship market and strive to move forward.

In terms of flagship chips, Li Yanji said that it is necessary to deploy products and technologies from the perspective of "laying out tomorrow from the day after tomorrow", as well as industrial chain cooperation. It took more than 2 years for the chip to go from planning to tape-out, to the final sample, and then to customer production. If you want to put a technology into mobile phone IC design, its IP design needs to be started earlier, even 3 years in advance, and it is also necessary to judge which new technologies will be used in mobile phones in 3 years. MediaTek's technical planning is more advanced, so that it can make more accurate predictions and judgments, including judgments on long-term market needs and customer needs in the future.

Taking the Dimensity 9000 as an example, its success benefits from the adoption of TSMC's most advanced 4nm process technology. In terms of advanced processes, MediaTek and TSMC have been cooperating for a long time. MediaTek and TSMC started a cooperation model in the first wave of adoption of the most advanced manufacturing process. On this basis, the most advanced process technology can also be used in the flagship products of MediaTek in the future.

In addition, Li Yanji said that in the development of high-end flagship phones, it is also very important to build global energy efficiency optimization technology. Taking the Dimensity 9000 as an example, in addition to using advanced manufacturing technology, the global energy efficiency optimization technology also enables different IP modules on the chip to function effectively, and reduces power consumption in all scenarios. In different application scenarios of light load, medium load and heavy load, the best energy efficiency optimization strategy can be achieved. In the future, MediaTek will continue to iterate and innovate around energy efficiency technologies to bring better user experience to end consumers.

MediaTek successfully established itself in the flagship mobile phone market with the Dimensity 9000, showing the industry that a true flagship chip can help users solve current pain points, increase market differentiation, and bring better quality to terminal manufacturers and consumers. choose. This is also a positive factor for the healthy development of the flagship market and user experience, which can promote healthy competition in terms of technical strength and demand insight, and accelerate the further advancement of mobile phone chip-related technologies.