Electronics

On July 26, Micron announced that it has started mass production of the world's first 232-layer NAND, which has the industry's highest areal density and offers higher capacity and higher energy efficiency compared to previous generations of Micron NAND.

"Micron's 232-layer NAND is a watershed in storage innovation, demonstrating for the first time the ability to scale 3D NAND beyond 200 layers," said Scott DeBoer, executive vice president of technology and products at Micron.

Officially, Micron's 232-layer NAND technology achieves the industry's fastest NAND I/O speed: 2.4 GB per second, 50% faster than Micron's 176-layer NAND. Micron's 232-layer NAND achieves the highest ever TLC density per square millimeter: 14.6 Gb/mm2. The 232-layer NAND ships in a new 11.5mm x 13.5mm package, which is 28 percent smaller than Micron's previous generations. Micron's 232L TLC NAND is called B58R, with a single die capacity of 1Tb, which can achieve a capacity of 2TB in a single chip package in a 16*Die package.

It is understood that Micron's 232-layer NAND is now in mass production at the company's Singapore factory and will initially be shipped to customers in the form of components through the Crucial SSD consumer product line.