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Mon to Fri 09:00 – 17:30
If you want to know more about the application and parameters of the product, please feel free to contact us. We are willing to serve you sincerely
Specification
| Purpose | The equipment can perform wafer etching and cleaning Clean process |
| Be applicable | 6”8”12"Wafer |
| UPH | 38Pcs (double cavity, processing time 180 seconds) |
| Chamber type | Single-wafer Bernoulli rotation machining chamber |
| Load/Unload | open cassette or Foup |
| CHUCK | Bernoulli and edge clamping rotary chucks |
| equipment control | Touch IPC+PLC |
| Processing capacity | ·Uniformity<5% ·Level 100 indoor environment ·No watermark traces on the chip ·Wafer backside DI flushing function ·Thin Wafer damage<1000PPM |
