Fully automatic electroplating equipment

1. Compatible with 12 inch and 8 inch wafers;

2. Fully automatic operation, foupin foupout;

3. Dry in - dry out;

4. The program can freely choose Cu plating or Cu plating/Sn plating

Au, free switching;

5. Scan code or RFID sensing automatic selection program, no need to operate

Employee selection;

6. Stainless steel SUS316 skeleton, coated with NPP, sturdy and

Corrosion resistance;

7. Industrial computer+PLC control, stable system;

8. Windows operating system, simple and convenient;

9. Support EAP function;

10. Compatible with semiconductor general SECS/GEM technology protocol;

11. Equipped with automatic addition function.