Wafer cleaning systems

Main advantages

Independently developed intelligent and precise transmission control system

Fully automatic chemical centralized liquid supply system (CDS)

Liquid overflow design reduces the amount of liquid medicine used per tablet,

Reduce usage costs

100% yield rate of wafer surface debonding

Equipment Through-Put production capacity of 200 pieces per hour

(Dual TANK)

Optional unit modules correspond to different cleaning and removal methods

demand

The medicine solution tank adopts a double tank design, which can achieve precision

Temperature control

Independently control the exhaust of waste liquid, effectively protecting personnel's work

Applicable process

Integrated circuit field: wafer cleaning

Advanced packaging field: TSV etching after adhesive removal process

UBM/RDL degumming process

Fully automatic cleaning equipment is widely used in the field of integrated circuits

The photoresist removal process in the field of advanced packaging.

Compared to traditional debonding equipment it has a higher degree of automation and adopts modular design, which can be adjusted according to based on customer customized process production needs,from design and development machine assembly, testing, equipment installation, and after-sales service.