Wafer horizontal electroplating equipment

Applications: Pillar,Bump,RDL,TSV and other processes

Wafer size: 150mm&200mm&300mm

Equipment features:

- Small size, high flexibility

- Horizontal plating cavity, no cross infection

- Support single cavity maintenance, improve the normal operation of equipment time

- Rubber sealing technology, better sealing performance

- Cathode and anode separation technology , better stability

- Type of plating solution: Cu,Ni,Sn/Ag,Au

- Up to 3 load ports

- Up to 8 plating chambers: Cu,Ni,Sn/Ag,Au

- With pre-wet chamber and cleaning function

-Nitrogen protection around the cavity

-Good deep hole step covering performance

Process index: Plating uniformity: WiW≤5%, WtW≤5%,RtR≤5%